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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - pocketboek

2007, ISBN: 3836427273

[SR: 3885868], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], 2007-12-17, VDM Verlag Dr. Müller, 189157, Chemie, 121, … Meer...

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Sheng Zhan:

Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - pocketboek

2007, ISBN: 3836427273

[SR: 3885868], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], 2007-12-17, VDM Verlag Dr. Müller, 189157, Chemie, 121, … Meer...

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - pocketboek

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290… Meer...

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - pocketboek

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290… Meer...

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Surface Insulation Resistance Degradation and Electrochemical Migration - Sheng Zhan
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Surface Insulation Resistance Degradation and Electrochemical Migration - pocketboek

ISBN: 9783836427272

Paperback, [PU: VDM Verlag Dr. Mueller E.K.], This is a Print on Demand title. This book may have occasional imperfections such as missing or blurred pages, poor pictures, errant marks, e… Meer...

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards
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Titel:
ISBN:

3836427273


Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM.

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EAN (ISBN-13): 9783836427272
ISBN (ISBN-10): 3836427273
pocket book
Verschijningsjaar: 2008
Uitgever: VDM Verlag Dr. Müller
132 Bladzijden
Gewicht: 0,263 kg
Taal: ger/Deutsch

Boek bevindt zich in het datenbestand sinds 2008-03-15T06:41:49+01:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2021-12-16T13:59:31+01:00 (Amsterdam)
ISBN/EAN: 3836427273

ISBN - alternatieve schrijfwijzen:
3-8364-2727-3, 978-3-8364-2727-2
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: han
Titel van het boek: resistance, lead and tin, migration

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