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Electromagnetic Compatibility Engineering - nieuw boek

ISBN: 9780470189306

Praise for Noise Reduction Techniques IN electronic systems 'Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare abilit… Meer...

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Electromagnetic Compatibility Engineering - gebonden uitgave, pocketboek

2009, ISBN: 9780470189306

Wiley, Hardcover, Auflage: First Edition, 880 Seiten, Publiziert: 2009-08-24T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 9780470189306, 1.32 kg, Verkaufsrang: 865663, Internet, Groupw… Meer...

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Henry W. Ott:
Electromagnetic Compatibility Engineering - gebonden uitgave, pocketboek

2009

ISBN: 0470189304

[EAN: 9780470189306], Neubuch, [PU: John Wiley and Sons Ltd], 2009. 1st. Hardcover. This expanded third edition of the most popular book on electromagnetic compatibility reflects all of t… Meer...

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Henry Ott:
Electromagnetic Compatibility Engineering - gebonden uitgave, pocketboek

2009, ISBN: 0470189304

Binding : Gebundene Ausgabe, Edition : 1. Auflage, Label : John Wiley & Sons, Publisher : John Wiley & Sons, NumberOfItems : 1, PackageQuantity : 1, medium : Gebundene Ausgabe, numberOfPa… Meer...

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Ott, Henry W.:
Electromagnetic Compatibility Engineering - gebonden uitgave, pocketboek

2009, ISBN: 0470189304

[EAN: 9780470189306], Gebraucht, sehr guter Zustand, [PU: Wiley], In Used Condition, Books

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Electromagnetic Compatibility Engineering

Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." --EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information--such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD--that made the previous book such a wide success, this new book includes additional coverage of: * Equipment/systems grounding * Switching power supplies and variable-speed motor drives * Digital circuit power distribution and decoupling * PCB layout and stack-up * Mixed-signal PCB layout * RF and transient immunity * Power line disturbances * Precompliance EMC measurements * New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.

Gedetalleerde informatie over het boek. - Electromagnetic Compatibility Engineering


EAN (ISBN-13): 9780470189306
ISBN (ISBN-10): 0470189304
Gebonden uitgave
pocket book
Verschijningsjaar: 2009
Uitgever: Wiley
843 Bladzijden
Gewicht: 1,310 kg
Taal: eng/Englisch

Boek bevindt zich in het datenbestand sinds 2008-06-09T18:58:24+02:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2024-03-10T16:06:16+01:00 (Amsterdam)
ISBN/EAN: 0470189304

ISBN - alternatieve schrijfwijzen:
0-470-18930-4, 978-0-470-18930-6
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: ott, henry may
Titel van het boek: noise reduction techniques electronic systems, electro, electromagnetic compatibility engineering


Gegevens van de uitgever

Auteur: Henry Ott
Titel: Electromagnetic Compatibility Engineering
Uitgeverij: Wiley; John Wiley & Sons
872 Bladzijden
Verschijningsjaar: 2009-09-11
Gewicht: 1,268 kg
Taal: Engels
149,00 € (DE)
Not available (reason unspecified)
164mm x 237mm x 43mm

BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik, Nachrichtentechnik; Electrical & Electronics Engineering; Electromagnetic Compatibility; Elektromagnetische Verträglichkeit; Elektronischen Rauschen; Elektrotechnik u. Elektronik; Noise in Electronic Systems; Elektromagnetische Verträglichkeit; Elektronischen Rauschen; BB

Preface. PART 1 EMC THEORY. 1. Electromagnetic Compatibility. 1.1 Introduction. 1.2 Noise and Interference. 1.3 Designing for Electromagnetic Compatibility. 1.4 Engineering Documentation and EMC. 1.5 United States' EMC Regulations. 1.6 Canadian EMC Requirements. 1.7 European Union's EMC Requirements. 1.8 International Harmonization. 1.9 Military Standards. 1.10 Avionics. 1.11 The Regulatory Process. 1.12 Typical Noise Path. 1.13 Methods of Noise Coupling. 1.14 Miscellaneous Noise Sources. 1.15 Use of Network Theory. 2. Cabling. 2.1 Capacitive Coupling. 2.2 Effect of Shield on Capacitive Coupling. 2.3 Inductive Coupling. 2.4 Mutual Inductance Calculations. 2.5 Effect of Shield on Magnetic Coupling. 2.6 Shielding to Prevent Magnetic Radiation. 2.7 Shielding a Receptor Against Magnetic Fields. 2.8 Common Impedance Shield Coupling. 2.9 Experimental Data. 2.10 Example of Selective Shielding. 2.11 Shield Transfer Impedance. 2.12 Coaxial Cable Versus Twisted Pair. 2.13 Braided Shields. 2.14 Spiral Shields. 2.15 Shield Terminations. 2.16 Ribbon Cables. 2.17 Electrically Long Cables. 3. Grounding. 3.1 AC Power Distribution and Safety Grounds. 3.2 Signal Grounds. 3.3 Equipment/System Grounding. 3.4 Ground Loops. 3.5 Low-Frequency Analysis of Common-Mode Choke. 3.6 High-Frequency Analysis of Common-Mode Choke. 3.7 Single Ground Reference for a Circuit. 4. Balancing and Filtering. 4.1 Balancing. 4.2 Filtering. 4.3 Power Supply Decoupling. 4.4 Driving Capacitive Loads. 4.5 System Bandwidth. 4.6 Modulation and Coding. 5. Passive Components. 5.1 Capacitors. 5.2 Inductors. 5.3 Transformers. 5.4 Resistors. 5.5 Conductors. 5.6 Transmission Lines. 5.7 Ferrites. 6. Shielding. 6.1 Near Fields and Far Fields. 6.2 Characteristic and Wave Impedances. 6.3 Shielding Effectiveness. 6.4 Absorption Loss. 6.5 Reflection Loss. 6.6 Composite Absorption and Reflection Loss. 6.7 Summary of Shielding Equations. 6.8 Shielding with Magnetic Materials. 6.9 Experimental Data. 6.10 Apertures. 6.11 Waveguide Below Cutoff. 6.12 Conductive Gaskets. 6.13 The ''IDEAL'' Shield. 6.14 Conductive Windows. 6.15 Conductive Coatings. 6.16 Internal Shields. 6.17 Cavity Resonance. 6.18 Grounding of Shields. 7. Contact Protection. 7.1 Glow Discharges. 7.2 Metal-Vapor or Arc Discharges. 7.3 AC Versus DC Circuits. 7.4 Contact Material. 7.5 Contact Rating. 7.6 Loads with High Inrush Currents. 7.7 Inductive Loads. 7.8 Contact Protection Fundamentals. 7.9 Transient Suppression for Inductive Loads. 7.10 Contact Protection Networks for Inductive Loads. 7.11 Inductive Loads Controlled by a Transistor Switch. 7.12 Resistive Load Contact Protection. 7.13 Contact Protection Selection Guide. 7.14 Examples. 8. Intrinsic Noise Sources. 8.1 Thermal Noise. 8.2 Characteristics of Thermal Noise. 8.3 Equivalent Noise Bandwidth. 8.4 Shot Noise. 8.5 Contact Noise. 8.6 Popcorn Noise. 8.7 Addition of Noise Voltages. 8.8 Measuring Random Noise. 9. Active Device Noise. 9.1 Noise Factor. 9.2 Measurement of Noise Factor. 9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor. 9.4 Noise Voltage and Current Model. 9.5 Measurment of Vn and In. 9.6 Calculating Noise Factor and S/N Ratio from Vn-In. 9.7 Optimum Source Resistance. 9.8 Noise Factor of Cascaded Stages. 9.9 Noise Temperature. 9.10 Bipolar Transistor Noise. 9.11 Field-Effect Transistor Noise. 9.12 Noise in Operational Amplifiers. 10. Digital Circuit Grounding. 10.1 Frequency Versus Time Domain. 10.2 Analog Versus Digital Circuits. 10.3 Digital Logic Noise. 10.4 Internal Noise Sources. 10.5 Digital Circuit Ground Noise. 10.6 Ground Plane Current Distribution and Impedance. 10.7 Digital Logic Current Flow. PART 2 EMC APPLICATIONS. 11. Digital Circuit Power Distribution. 11.1 Power Supply Decoupling. 11.2 Transient Power Supply Currents. 11.3 Decoupling Capacitors. 11.4 Effective Decoupling Strategies. 11.5 The Effect of Decoupling on Radiated Emissions. 11.6 Decoupling Capacitor Type and Value. 11.7 Decoupling Capacitor Placement and Mounting. 11.8 Bulk Decoupling Capacitors. 11.9 Power Entry Filters. 12. Digital Circuit Radiation. 12.1 Differential-Mode Radiation. 12.2 Controlling Differential-Mode Radiation. 12.3 Common-Mode Radiation. 12.4 Controlling Common-Mode Radiation. 13. Conducted Emissions. 13.1 Power Line Impedance. 13.2 Switched-Mode Power Supplies. 13.3 Power-Line Filters. 13.4 Primary-to-Secondary Common-Mode Coupling. 13.5 Frequency Dithering. 13.6 Power Supply Instability. 13.7 Magnetic Field Emissions. 13.8 Variable Speed Motor Drives. 13.9 Harmonic Suppression. 14. RF and Transient Immunity. 14.1 Performance Criteria. 14.2 RF Immunity. 14.3 Transient Immunity. 14.4 Power Line Disturbances. 15. Electrostatic Discharge. 15.1 Static Generation. 15.2 Human Body Model. 15.3 Static Discharge. 15.4 ESD Protection in Equipment Design. 15.5 Preventing ESD Entry. 15.6 Hardening Sensitive Circuits. 15.7 ESD Grounding. 15.8 Nongrounded Products. 15.9 Field-Induced Upset. 15.10 Transient Hardened Software Design. 15.11 Time Windows. 16. PCB Layout and Stackup. 16.1 General PCB Layout Considerations. 16.2 PCB-to-Chassis Ground Connection. 16.3 Return Path Discontinuities. 16.4 PCB Layer Stackup. 17. Mixed-Signal PCB Layout. 17.1 Split Ground Planes. 17.2 Microstrip Ground Plane Current Distribution. 17.3 Analog and Digital Ground Pins. 17.4 When Should Split Ground Planes Be Used? 17.5 Mixed Signal ICs. 17.6 High-Resolution A/D and D/A Converters. 17.7 A/D and D/A Converter Support Circuitry. 17.8 Vertical Isolation. 17.9 Mixed-Signal Power Distribution. 17.10 The IPC Problem. 18. Precompliance EMC Measurements. 18.1 Test Environment. 18.2 Antennas Versus Probes. 18.3 Common-Mode Currents on Cables. 18.4 Near Field Measurements. 18.5 Noise Voltage Measurements. 18.6 Conducted Emission Testing. 18.7 Spectrum Analyzers. 18.8 EMC Crash Cart. 18.9 One-Meter Radiated Emission Measurements. 18.10 Precompliance Immunity Testing. 18.11 Precompliance Power Quality Tests. 18.12 Margin. APPENDIX. A. The Decibel. A.1 Properties of Logarithms. A.2 Using the Decibel for Other than Power Measurements. A.3 Power Loss or Negative Power Gain. A.4 Absolute Power Level. A.5 Summing Powers Expressed in Decibels. B. The Ten Best Ways to Maximize the Emission from Your Product. C. Multiple Reflections of Magnetic Fields in Thin Shields. D. Dipoles for Dummies. D.1 Basic Dipoles for Dummies. D.2 Intermediate Dipoles for Dummies. D.3 Advanced Dipoles for Dummies. E. Partial Inductance. E.1 Inductance. E.2 Loop Inductance. E.3 Partial Inductance. E.4 Ground Plane Inductance Measurement Test Setup. E.5 Inductance Notation. F. Answers to Problems. Index.

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