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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, th… Meer...

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ISBN: 9789048146963

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Advances in Rapid Thermal and Integrated Processing F. Roozeboom Editor

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Gedetalleerde informatie over het boek. - Advances in Rapid Thermal and Integrated Processing F. Roozeboom Editor


EAN (ISBN-13): 9789048146963
ISBN (ISBN-10): 9048146968
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer Netherlands Core >1
580 Bladzijden
Gewicht: 0,865 kg
Taal: eng/Englisch

Boek bevindt zich in het datenbestand sinds 2012-11-07T18:53:56+01:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2020-03-22T00:35:30+01:00 (Amsterdam)
ISBN/EAN: 9789048146963

ISBN - alternatieve schrijfwijzen:
90-481-4696-8, 978-90-481-4696-3


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Laatste soortgelijke boek:
9789401587112 Advances in Rapid Thermal and Integrated Processing (F. Roozeboom)


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