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Structural Integrity and Reliability in Electronics : Enhancing Performance in a Lead-Free Environment - W. J. Plumbridge
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Structural Integrity and Reliability in Electronics : Enhancing Performance in a Lead-Free Environment - pocketboek

2010, ISBN: 9048164958

[EAN: 9789048164950], Neubuch, [SC: 0.0], [PU: Springer Netherlands], STATISTICALANALYSIS; STATISTICA; ALLOY; CALCULUS; CIRCUIT; COMMUNICATION; CONSTRUCTION; DESIGN; FINITEELEMENTMETHOD; … Meer...

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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment W.J. Plumbridge Author
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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment W.J. Plumbridge Author - nieuw boek

ISBN: 9789048164950

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the… Meer...

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ISBN: 9789048164950

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the… Meer...

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Structural Integrity and Reliability in Electronics - pocketboek

2010, ISBN: 9789048164950

Erscheinungsdatum: 19.10.2010, Medium: Taschenbuch, Einband: Kartoniert / Broschiert, Titel: Structural Integrity and Reliability in Electronics, Titelzusatz: Enhancing Performance in a L… Meer...

Nr. 71787197. Verzendingskosten:, Next Day, DE. (EUR 0.00)
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Structural Integrity and Reliability in Electronics - R. J. Matela/ W. J. Plumbridge/ A. Westwater
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Structural Integrity and Reliability in Electronics - pocketboek

2003, ISBN: 9048164958

Structural Integrity and Reliability in Electronics ab 199.99 € als Taschenbuch: Enhancing Performance in a Lead-Free Environment. Auflage 2003. Aus dem Bereich: Bücher, Wissenschaft, Tec… Meer...

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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment W.J. Plumbridge Author

The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.

Gedetalleerde informatie over het boek. - Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment W.J. Plumbridge Author


EAN (ISBN-13): 9789048164950
ISBN (ISBN-10): 9048164958
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer Netherlands Core >1
356 Bladzijden
Gewicht: 0,567 kg
Taal: eng/Englisch

Boek bevindt zich in het datenbestand sinds 2012-04-20T20:52:41+02:00 (Amsterdam)
Boek voor het laatst gevonden op 2023-12-11T18:17:19+01:00 (Amsterdam)
ISBN/EAN: 9789048164950

ISBN - alternatieve schrijfwijzen:
90-481-6495-8, 978-90-481-6495-0
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: matela, plumb
Titel van het boek: art electronics, structural reliability


Gegevens van de uitgever

Auteur: W.J. Plumbridge; R.J. Matela; A. Westwater
Titel: Structural Integrity and Reliability in Electronics - Enhancing Performance in a Lead-Free Environment
Uitgeverij: Springer; Springer Netherland
336 Bladzijden
Verschijningsjaar: 2010-10-19
Dordrecht; NL
Gedrukt / Gemaakt in
Taal: Engels
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XIX, 336 p. 248 illus.

BC; Hardcover, Softcover / Technik/Bautechnik, Umwelttechnik; Bauingenieur-, Vermessungs- und Bauwesen; Verstehen; Statistica; alloy; calculus; circuit; communication; construction; design; electronics; environment; finite element method; material; microelectronics; simulation; statistical analysis; Civil Engineering; Characterization and Analytical Technique; Machines, Tools, Processes; Classical Mechanics; Mathematical and Computational Engineering Applications; Werkstoffprüfung; Fertigungstechnik und Ingenieurwesen; Klassische Mechanik; Mathematik für Ingenieure; BB

Setting the Scene.- to the Properties of Materials.- More Complex Mechanical Behaviour.- Mechanical Testing (For Electronics Applications).- Mechanical Properties of Bulk Solders.- Mechanical Behaviour of Solder Joints.- Electronic Components and Their Construction.- Printed Circuit Board Assembly Methods and Technologies.- Fundamentals of Failure Analysis.- Analysis of PCB and Electronic Component Failure.- Making the Transition to a Reliable Lead-free Solder Process.- to Life Prediction.- Life Prediction by Crack Propagation Approach.- Reliability and Statistical Analysis of Data.- Thermal and Mechanical Simulation in Microelectronics.- Finite Element Analysis.- Non-linear Finite Element Analysis.- Case Study.

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