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Bonding in Microsystem Technology - Dziuban, Jan A.
(*)
Dziuban, Jan A.:
Bonding in Microsystem Technology - pocketboek

2010, ISBN: 9789048171514

[ED: Softcover], [PU: Springer Netherlands], This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, TAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author s personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources. 2010. xviii, 334 S. 235 mm Versandfertig in 6-10 Tagen, DE, [SC: 0.00], Neuware, gewerbliches Angebot, offene Rechnung (Vorkasse vorbehalten)

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Bonding in Microsystem Technology - Jan A. Dziuban
(*)
Jan A. Dziuban:
Bonding in Microsystem Technology - nieuw boek

ISBN: 9789048171514

ID: 978904817151

Bonding in Microsystem Technologyconcerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three - dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.Bonding in Microsystem Technologystarts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author''s personal experience.Bonding in Microsystem Technologyis addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources. Jan A. Dziuban, Books, Science and Nature, Bonding in Microsystem Technology Books>Science and Nature, Springer-Verlag/Sci-Tech/Trade

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Bonding in Microsystem Technology - Jan A. Dziuban
(*)
Jan A. Dziuban:
Bonding in Microsystem Technology - nieuw boek

ISBN: 9789048171514

ID: 978904817151

Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, uTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three - dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author''s personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources. Jan A. Dziuban, Books, Science and Nature, Bonding in Microsystem Technology Books>Science and Nature, Springer Netherlands

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Bonding in Microsystem Technology - Jan A. Dziuban
(*)
Jan A. Dziuban:
Bonding in Microsystem Technology - pocketboek

ISBN: 9789048171514

ID: 9789048171514

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience. Books > Engineering Soft cover, Springer Shop

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Bonding in Microsystem Technology - Dziuban, Jan A.
(*)
Dziuban, Jan A.:
Bonding in Microsystem Technology - pocketboek

2010, ISBN: 9048171512

gebonden uitgave, ID: A12367840

Softcover reprint of hardcover 1st ed. 2006 Kartoniert / Broschiert Ingenieurswesen, Maschinenbau allgemein, Fertigungstechnik und Ingenieurwesen, Elektronik, Elektronische Geräte und Materialien, Natur; bonding/anodic bonding; deep micromachining; design; development; electronics; glass; machining; microelectromechanical system (MEMS); microengineering; microsystems; silicon, mit Schutzumschlag neu, [PU:Springer Netherlands; Springer Netherland]

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Bijzonderheden over het boek
Bonding in Microsystem Technology

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Gedetalleerde informatie over het boek. - Bonding in Microsystem Technology


EAN (ISBN-13): 9789048171514
ISBN (ISBN-10): 9048171512
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer-Verlag/Sci-Tech/Trade
352 Bladzijden
Gewicht: 0,532 kg
Taal: eng/Englisch

Boek bevindt zich in het datenbestand sinds 2011-01-04T09:33:53+01:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2019-02-14T01:47:08+01:00 (Amsterdam)
ISBN/EAN: 9789048171514

ISBN - alternatieve schrijfwijzen:
90-481-7151-2, 978-90-481-7151-4


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