2010, ISBN: 9789048172313
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[EAN: 9789048172313], Neubuch, [PU: Springer Netherlands], COMPUTER-AIDEDDESIGN(CAD) SIMULATION DESIGN DEVELOPMENT ELECTRONICPACKAGING MECHANICALENGINEERING MODELING OPTIMIZATION RELIABIL… Meer...
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2010, ISBN: 9789048172313
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2010, ISBN: 9789048172313
[ED: Softcover], [PU: Springer / Springer Netherlands], This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the mi… Meer...
2010, ISBN: 9048172314
[EAN: 9789048172313], Neubuch, [PU: Springer Netherlands], COMPUTER-AIDEDDESIGN(CAD) SIMULATION DESIGN DEVELOPMENT ELECTRONICPACKAGING MECHANICALENGINEERING MODELING OPTIMIZATION RELIABIL… Meer...
2010
ISBN: 9789048172313
pocketboek
[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers issues essential for cur… Meer...
2010, ISBN: 9789048172313
pocketboek
[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers issues essential for cur… Meer...
2010, ISBN: 9048172314
gebonden uitgave
Softcover reprint of hardcover 1st ed. 2006 Kartoniert / Broschiert Künstliche Intelligenz, Virtualprototyping; computer-aideddesign(CAD); Simulation; Design; Development; electronicpac… Meer...
Bibliografische gegevens van het best passende boek
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Gedetalleerde informatie over het boek. - Mechanics of Microelectronics
EAN (ISBN-13): 9789048172313
ISBN (ISBN-10): 9048172314
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer
584 Bladzijden
Gewicht: 0,918 kg
Taal: eng/Englisch
Boek bevindt zich in het datenbestand sinds 2011-09-27T15:16:06+02:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2023-06-10T14:36:52+02:00 (Amsterdam)
ISBN/EAN: 9789048172313
ISBN - alternatieve schrijfwijzen:
90-481-7231-4, 978-90-481-7231-3
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: fan, van driel, zhang
Titel van het boek: microelectronics, zhang
Gegevens van de uitgever
Auteur: G.Q. Zhang
Titel: Solid Mechanics and Its Applications; Mechanics of Microelectronics
Uitgeverij: Springer; Springer Netherland
566 Bladzijden
Verschijningsjaar: 2010-11-22
Dordrecht; NL
Gedrukt / Gemaakt in
Gewicht: 0,918 kg
Taal: Engels
219,99 € (DE)
BC; Theoretical and Applied Mechanics; Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik; Maschinenbau; Verstehen; Computer-Aided Design (CAD); Simulation; design; development; electronic packaging; mechanical engineering; mechanics; microelectronics; modeling; optimization; reliability; stability; statistics; thermo-mechanics; virtual prototyping; Mechanical Engineering; Computational Intelligence; Engineering Mechanics; Mechanical Engineering; Computational Intelligence; Künstliche Intelligenz; BB
Microelectronics technology Introduction A heart of silicon In a little black box Baseline CMOS Non-CMOS options Packaging Systems Conclusions References Nomenclature Reliability practices Introduction Reliability assessment Reliability statistics Acceleration factor models Failure mechanisms Conclusions References Exercises Thermal Management Introduction Heat transfer basics Thermal design of assemblies Thermal design for a SQFP Heatsink design choices Conclusions / final remarks References Introduction to Advanced Mechanics Introduction Stress and strain Failure criteria Fracture mechanics Finite element method References Exercises Thermo-Mechanics of Integrated Circuits and Packages Introduction IC Backend and packaging processes and testing Thermo-mechanics of IC backend processes Thermo-Mechanics of packaging processes Thermo-Mechanics of coupled IC backend and packaging processes Case studies References Exercises Characterization and Modeling of Moisture Behavior Introduction Moisture diffusion modeling Characterization of moisture diffusivity and saturation concentration Vapor pressure modeling Hygroscopic swelling characterization & modeling Single void Instability behavior Subjected to vapor pressure and thermal stress Interface strength characterization and modeling Case studies References Exercises Characterization and Modeling of Solder Joint Reliability Introduction Analytical-empirical prognosis of the reliability Thermo-mechanical characteristics of soft solders Data evaluation and LIFE-time estimation Case studies References Exercises Virtual thermo-mechanical prototyping Introduction The state-of-the-art of virtual prototyping Case studies Conclusions References Exercises Challenges and future perspectives Introduction Product and process inputs Tests and experiments Multi-scale mechanics Advanced simulation tools Multi-physics modeling Material and interface behavior Simulation-based optimization ConclusionsAndere boeken die eventueel grote overeenkomsten met dit boek kunnen hebben:
Laatste soortgelijke boek:
9781402049347 Mechanics of Microelectronics (Zhang, G.Q., W.D. van Driel und X.J. Fan)
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