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Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms - pocketboek
2010, ISBN: 9789048179169
Mitwirkende: Meyr, Heinrich, Mitwirkende: Leupers, Rainer, Springer, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2008, 176 Seiten, Publiziert: 2010-10-19T00:00:01Z, Produ… Meer...
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ISBN: 9789048179169
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Wieferink, Andreas; Leupers, Rainer; Meyr, Heinrich:
Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms - pocketboek2010, ISBN: 9048179165
gebonden uitgave
Softcover reprint of hardcover 1st ed. 2008 Kartoniert / Broschiert Wissensbasierte Systeme, Expertensysteme, Application-SpecificInstruction-SetProcessor(ASIP); ElectronicSystemLevel(E… Meer...

Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms - eerste uitgave
2010
ISBN: 9789048179169
pocketboek
[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. New methodology with potential … Meer...

Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms - pocketboek
2010, ISBN: 9789048179169
Mitwirkende: Meyr, Heinrich, Mitwirkende: Leupers, Rainer, Springer, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2008, 176 Seiten, Publiziert: 2010-10-19T00:00:01Z, Produ… Meer...

Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms - pocketboek
2008, ISBN: 9048179165
gebonden uitgave
Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms ab 119.99 € als Taschenbuch: Softcover reprint of hardcover 1st ed. 2008. Aus dem Bereich: Bücher, … Meer...
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Gedetalleerde informatie over het boek. - Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
EAN (ISBN-13): 9789048179169
ISBN (ISBN-10): 9048179165
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer
176 Bladzijden
Gewicht: 0,275 kg
Taal: eng/Englisch
Boek bevindt zich in het datenbestand sinds 2011-10-11T12:03:00+02:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2022-03-16T19:41:08+01:00 (Amsterdam)
ISBN/EAN: 9789048179169
ISBN - alternatieve schrijfwijzen:
90-481-7916-5, 978-90-481-7916-9
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: heinrich andreas, leu andre, meyr, rainer heinrich
Titel van het boek: chip
Gegevens van de uitgever
Auteur: Andreas Wieferink; Heinrich Meyr; Rainer Leupers
Titel: Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms
Uitgeverij: Springer; Springer Netherland
162 Bladzijden
Verschijningsjaar: 2010-10-19
Dordrecht; NL
Gedrukt / Gemaakt in
Gewicht: 0,454 kg
Taal: Engels
106,99 € (DE)
109,99 € (AT)
118,00 CHF (CH)
POD
XIV, 162 p.
BC; Circuits and Systems; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Verstehen; Application-Specific Instruction-Set Processor (ASIP); Electronic System Level (ESL) Design; Multi-Processor System-on-Chip (MP-SoC); Transaction Level Modeling (TLM); integrated circuit; micro-alloy transistor; organization; Special Purpose and Application-Based Systems; Electronic Circuits and Systems; Special Purpose and Application-Based Systems; Wissensbasierte Systeme, Expertensysteme; BB
Foreword. Preface. 1. INTRODUCTION. 1.1 Challenge: From Board to SoC. 1.2 Degrees of SoC Customization. 1.3 Organization of this Book. 2. SOC DESIGN METHODOLOGIES. 2.1 Traditional HW/SW Co-Design. 2.2 System Level Design. 2.3 Current Research on SoC Design Methodologies. 2.4 Contribution of this Work. 3. COMMUNICATION MODELING. 3.1 Transaction Level Modeling. 3.2 Generic Communication Modeling. 3.3 Communication Customization. 3.4 The BusCompiler Tool. 4. PROCESSOR MODELING. 4.1 Generic Processor Modeling. 4.2 Processor Customization Techniques. 4.3 LISA. 5. PROCESSOR SYSTEM INTEGRATION. 5.1 Simulator Structure. 5.2 Adaptors: Bridging Abstraction Gaps. 5.3 Commercial SoC Simulation Environments. 6. SUCCESSIVE TOP-DOWN REFINEMENT FLOW. 6.1 Phase 1: Standalone. 6.2 Phase 2: IA ASIP - AVF Communication Models. 6.3 Phase 3: IA ASIP - CA TLM Bus. 6.4 Phase 4: CA ASIP - CA TLM Bus. 6.5 Phase 5: BCA ASIP - CA TLM Bus. 6.6 Phase 6: RTL ASIP - CA TLM Bus. 6.7 Phase 7: RTL ASIP - RTL Bus. 7. AUTOMATIC RETARGETABILITY. 7.1 MP-SoC Simulator Generation Chain. 7.2 Structure of the Generated Simulator. 7.3 Bus Interface Specification. 8. DEBUGGING AND PROFILING. 8.1 Multiprocessor Debugger. 8.2 TLM Bus Traffic Visualization. 8.3 Bus Interface Analysis. 9. CASE STUDY. 9.1 Multi Processor JPEG Decoding Platform. 9.2 Phase 2: IA+AVF Platform. 9.3 Phase 3: IA + BusCompiler Platform. 9.4 Phase 4: CA + BusCompiler Platform. 9.5 Phase 5: BCA + BusCompiler Platform. 10. SUMMARY. Appendices. A. Businterface Definition Files. A.1 Generic AMBA 2.0 Protocol. A.2 Derived AMBA 2.0 Protocols. A.3 AMBA 2.0 Bus Interface Specification. B. Extended CoWare Tool Flow. List of Figures. References. Index.Andere boeken die eventueel grote overeenkomsten met dit boek kunnen hebben:
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