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Antonis Papanikolaou:

Three Dimensional System Integration : IC Stacking Process and Design - gebonden uitgave, pocketboek

2010, ISBN: 1441909613

[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTIO… Meer...

NEW BOOK. Verzendingskosten:Versandkostenfrei. (EUR 0.00) AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)]
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Three Dimensional System Integration - nieuw boek

2015, ISBN: 9781441909619

[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more funct… Meer...

Verzendingskosten:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) BuchWeltWeit Inh. Ludwig Meier e.K.
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Three Dimensional System Integration - nieuw boek

ISBN: 9781441909619

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… Meer...

Nr. 978-1-4419-0961-9. Verzendingskosten:Worldwide free shipping, , DE. (EUR 0.00)
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Antonis Papanikolaou:
Three Dimensional System Integration: IC Stacking Process and Design - gebonden uitgave, pocketboek

ISBN: 9781441909619

Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld… Meer...

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Three Dimensional System Integration: IC Stacking Process and Design - gebonden uitgave, pocketboek

2010, ISBN: 1441909613

[EAN: 9781441909619], New book, [PU: Springer], Books

NEW BOOK. Verzendingskosten: EUR 3.99 Lucky's Textbooks, Dallas, TX, U.S.A. [60577173] [Rating: 5 (of 5)]
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Three Dimensional System Integration: IC Stacking Process and Design
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ISBN:

1441909613


Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Gedetalleerde informatie over het boek. - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Gebonden uitgave
pocket book
Verschijningsjaar: 2010
Uitgever: Springer
246 Bladzijden
Gewicht: 0,527 kg
Taal: eng/Englisch

Boek bevindt zich in het datenbestand sinds 2008-04-22T15:15:08+02:00 (Amsterdam)
Detailpagina laatst gewijzigd op 2024-04-05T11:40:27+02:00 (Amsterdam)
ISBN/EAN: 1441909613

ISBN - alternatieve schrijfwijzen:
1-4419-0961-3, 978-1-4419-0961-9
alternatieve schrijfwijzen en verwante zoekwoorden:
Auteur van het boek: papanikolaou, rado, papan, radojcic, riko
Titel van het boek: three dimensional design, integration, whole system design, process design

Gegevens van de uitgever

Auteur: Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
Titel: Three Dimensional System Integration - IC Stacking Process and Design
Uitgeverij: Springer; Springer US
246 Bladzijden
Verschijningsjaar: 2010-12-15
New York; NY; US
Gedrukt / Gemaakt in
Taal: Engels
53,49 € (DE)
54,99 € (AT)
59,00 CHF (CH)
POD
VIII, 246 p.

BB; Hardcover, Softcover / Technik/Bautechnik, Umwelttechnik; Hochbau und Baustoffe; Verstehen; 3D Chip Stacking; 3D Integrated Circuit Design and Manufacturing; 3D Integrated Circuits; 3D Stacked Integrated Circuits; 3D System Integration; Contactless 3D Coupling; DRAM Stacking; Logic Stacking; TSV; Through-Silicon Vias; Building Construction and Design; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); BC

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of theinteractions between the various phases of design and manufacturing.
Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems Includes supplementary material: sn.pub/extras

Andere boeken die eventueel grote overeenkomsten met dit boek kunnen hebben:

Laatste soortgelijke boek:
9781489981820 Three Dimensional System Integration (Papanikolaou, Antonis|Soudris, Dimitrios|Radojcic, Riko)

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